Chip Flatness Inspection with SinceVision 3D Laser Profiler
Industry pain points and demands
In the semiconductor industry, chip flatness is critical for reliable packaging, manufacturing yield, and performance. However, uneven surfaces pose significant challenges. They can lead to poor solder connections, reduce production yield due to misalignment in flip-chip and SMT processes, introduce mechanical stress causing failures, impair thermal performance in high-power chips, and disrupt advanced packaging technologies like TSVs and micro-bumps.
Additionally, warped chips can cause misalignment in high-speed assembly lines, affecting manufacturing precision. Ensuring flatness is essential to mitigate these issues and enhance overall chip reliability and longevity.
SinceVision Solutions: SR9040 3D Laser Profiler
01High Precision Measurement: The SR9040 provides 6400 contour points with a resolution of 3μm x and ±0.02% of FS linearity, ensuring accurate detection of even the slightest deviations in chip flatness.
02Industry-Leading Contour Points: With the highest number of X-axis contour points in the industry, the SR9040 delivers high-speed and high-precision solutions for complex detection requirements.
03Enhanced Manufacturing Efficiency: By ensuring precise flatness, the SR9040 helps improve manufacturing yield, reduce defects, and enhance overall chip performance and reliability.
Camera Selection
| Model number | SR9040 | |||
| Reference distance (CD) | 40mm | |||
| Measuring range | Z-axis height (FS) | 6.6mm | ||
| X-axis width | Near side | 16.2mm | ||
| Reference distance | 17mm | |||
| Remote side | 18mm | |||
| Light source | Light source wavelength | 405nm blue light | ||
| Laser class | 2M | |||
| Laser output power | 10mW | |||
| Repetition accuracy | Z-axis (height) | 0.1μm | ||
| X-axis (width) | 0.6μm | |||
| linearity | Z-axis (height) | ±0.02% of F.S. | ||
| Contour data interval | X-axis (width) | 3μm | ||
| X-axis contour points | 6400 | |||
| Reflection Angle (°) | 50 | |||
| Scanning speed (Hz) | 1500 ~ 13000 | |||
| Dimension (mm) | 179×69. 5×130 | |||
| Weight (g) | 1920 | |||
| Temperature characteristic | 0.02% F.S./℃ | |||
| Encoder input | Single-ended, differential encoder is supported | |||
| Input/output | One 100Base-TX/1000Base-T Ethernet interface | |||
| Operation Temperature | 0～50℃ | |||
| Storage Temperature | -20～70℃ | |||
| Working Humidity | 35% to 85% without condensation | |||
| ESD Protection | Contact discharge 4kV, air discharge 8kV, in accordance with IEC 61000-4-2 standards | |||
| EFT protection | Power port 2kV/5 or 100kHz, signal port 1kV/5 or 100kHz, in accordance with IEC 61000-4-4 standards | |||
| Impact | 50Gs/3ms per axis, in accordance with IEC 68-2-27 Ea standard | |||
| Vibration | 10Gs (10-500Hz), compliant with IEC 68-2-6 Fc standard | |||
| degrees of protection provided by enclosure | IP67, in accordance with IEC 60529 standard | |||