Smartphone Middle Bezel & Frame Flatness Inspection with 3D Laser Profiler

Smartphone Middle Bezel & Frame Flatness Inspection with 3D Laser Profiler
Smartphone Middle Bezel & Frame Flatness Inspection with 3D Laser Profiler
Smartphone Middle Bezel & Frame Flatness Inspection with 3D Laser Profiler
Smartphone Middle Bezel & Frame Flatness Inspection with 3D Laser Profiler

Smartphone Middle Bezel & Frame Flatness Inspection with 3D Laser Profiler

Industry pain points and demands

In the consumer electronics industry, particularly in smartphone manufacturing, the flatness of the smartphone frame is a critical quality metric. Frame flatness not only affects the aesthetic appeal of the device but also plays a significant role in ensuring proper assembly and functionality.

 

Any deviations in flatness can lead to issues such as improper fitment of components, decreased structural integrity, and compromised user experience. Therefore, manufacturers face the challenge of efficiently and accurately measuring frame flatness to ensure that only frames meeting stringent quality standards proceed to assembly.


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SinceVision Solutions: SRI7140 3D Laser Profiler

01Micron-Level Precision: The SRI7140 boasts an impressive 10μm repetition accuracy, allowing manufacturers to detect even the smallest deviations in frame flatness. This high level of precision ensures that all frames meet the required standards before moving on to assembly.
02Comprehensive Scanning Capabilities: With 3200 X-axis contour points, the SRI7140 can perform multi-area flatness detection in a single scan. This capability enables thorough inspections without the need for multiple setups, significantly reducing inspection time while maintaining accuracy.
03Non-Contact Measurement: The non-contact nature of the SRI7140 eliminates the risk of scratches or damage during inspections, making it ideal for delicate smartphone frames. This feature ensures that manufacturers can conduct quick and precise inspections without compromising product quality.

Camera Selection

Model number
SRI7140
Reference distance (CD)140mm
Measuring rangeZ-axis height (FS)+34mm, -54mm (FS=88mm)
X-axis widthNear side70mm
Reference distance86mm
Remote side110mm
Light sourceLight source wavelength405nm
Laser class2M
Laser output power10mW
Repetition accuracyZ-axis (height)0.5μm
X-axis (width)7.5μm
linearityZ-axis (height)±0.02% of F.S.
Contour data intervalX-axis (width)30μm
X-axis contour points3200
Scanning speed (Hz)1500-20000Hz
Dimension (mm)155.5 x 54 x 94.5mm
Weight (g)1000
Temperature characteristic0.01% F.S./℃
Encoder inputDifferential encoder (trigger)④, start signal⑤
Input/outputOne 100Base-TX/1000Base-T Ethernet interface
Operation Temperature0~50℃
Storage Temperature

-20~70℃

Working Humidity35% to 85% without condensation
ESD ProtectionContact discharge 4kV, air discharge 8kV, in accordance with IEC 61000-4-2 standards
EFT protectionPower port 2kV/5 or 100kHz, signal port 1kV/5 or 100kHz, in accordance with IEC 61000-4-4 standards
Impact15Gs/6ms per axis, in accordance with IEC 68-2-27 Ea standard
Vibration(10-150Hz), compliant with IEC 68-2-6 Fc standard
degrees of protection provided by enclosureIP67, in accordance with IEC 60529 standard
Data cable (network cable) model

Type L: SCB-HNET-HR2Z-3m/6m/10m

Type I: SCB-HNET-HB2Z-3m/6m/10m

Data cable (IO cable) model

Type L: SCB-HIO-HR2Z-3m/6m/10m

Type I: SCB-HIO-HB2Z-3m/6m/10m