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SinceVision’s SG5020 Laser Displacement Sensor offers unmatched precision in vibration detection for sound systems. This advanced non-contact technology ensures accurate, high-speed measurements across industries such as automotive, aerospace, construction, and audiometry. Discover how it optimizes performance with its industry-leading sampling frequency and robust stability.

Discover the latest advancements in sensor technology at ITE 2024. Join SinceVision to explore our cutting-edge 3D laser profilers, high-speed cameras, and more. Experience the future of precision measurement and automation.

The SD-C Series is the latest breakthrough in SinceVision’s lineup of high-accuracy laser displacement sensors. This economical laser displacement sensor line brings together precision, stability, a compact design, and versatile communication options. Covering working ranges from 25mm to 600mm, the SD-C Series addresses applications requiring displacement, distance, thickness, height, roundness, step height, warping, vibration, and flatness measurement. Designed to meet the diverse needs of machine vision and quality control, this laser displacement transducer is an ideal solution across industrial automation scenarios, providing an affordable, reliable option that supports manufacturing innovation and cost-efficiency goals.

SinceVision’s newly launched Smart Series high-speed camera brings unparalleled capabilities and next-gen precision to motion analysis, industrial applications, scientific research, and sports analytics. Designed to deliver both ultra-high frame rates and remarkable accuracy, the Smart Series meets the needs of advanced machine vision, automation, and precision sensor applications. It’s the ultimate tool for high-speed imaging with flexible configurations and robust design that supports both industrial and scientific applications.

In the chip packaging testing phase, accurate detection of wafer concentricity and notch positioning is critical for improving the accuracy of wafer cutting. Proper alignment of the wafer center and notch position directly influences the yield of chip production, making it essential to implement effective measurement solutions. This article discusses the challenges associated with wafer concentricity and notch detection and presents a reliable solution using SinceVision's high-precision edge measurement sensors. Application Scenario During the chip packaging process, wafers must be precisely centered and aligned to ensure successful cutting and placement of chips. The concentricity of the wafer and the position of the notch must be accurately detected to enhance cutting precision and minimize waste. Any misalignment can lead to defective chips, resulting in increased production costs and reduced yield.

SinceVision, a leading manufacturer of advanced sensor technology, is excited to announce its participation in the VISION Show Germany, taking place from October 8 to 10, 2024. The company will be showcasing live demonstrations of its innovative solutions, including high-speed cameras, 3D laser profilers, laser displacement sensors, confocal spectral displacement sensors, and through-edge beam sensors. As the world's premier trade fair for machine vision, the VISION Show provides a comprehensive overview of the latest trends, suppliers, and innovations within the industry. Attendees will have the opportunity to explore the most advanced technologies and gain insights into the future of image processing.

In the battery cell production process, ensuring the integrity and alignment of electrode plates is crucial for maintaining quality. As the final detection station in the winding process, real-time detection of edge position and damage is essential to avoid quality issues stemming from misaligned or damaged electrodes. This article discusses the implementation of SinceVision's high-precision edge measurement sensor, the SE1 series, to address these challenges effectively.

SinceVision has established itself as a leader in cutting-edge sensor technology, particularly in the realm of 3D laser profilers. These advanced measuring instruments play a crucial role in various manufacturing processes, especially within the photovoltaic (PV) industry. This article will delve into the diverse applications of SinceVision's 3D laser profilers, highlighting their significance in ensuring quality control and precision measurement in solar cell production. Applications in Silicon Wafer Manufacturing 1. Wafer Thickness, Line Mark, and TTV Detection a. Application Scenario After the silicon wafer is produced, it needs to be tested by a sorting machine for multiple indicators such as thickness, linear marks, TTV, warpage, etc. to determine whether the silicon wafer meets the set requirements, and then sorted into the corresponding bin box according to the test data, and finally the silicon wafer is sorted into different grades.

SinceVision, a leading provider of advanced machine vision solutions, is excited to announce its participation in Automation Expo 2024, taking place in Mumbai, India, from August 21st to August 24th. As one of the most influential events in the automation industry, Automation Expo offers a unique platform for SinceVision to showcase its latest innovations and explore new business opportunities in the rapidly growing Indian market.