Standard Block Thickness Measurement with 3D Laser Profiler
Industry pain points and demands
In the semiconductor, optics, and precision manufacturing industries, standard block thickness measurement is essential for ensuring product quality and process stability.
Key challenges include:
1. Maintaining high-precision, non-contact measurements in real-time to meet stringent industry standards for semiconductor components, optical coatings, and machined parts.
2. Mitigating measurement errors caused by temperature fluctuations and material thermal expansion, which can compromise accuracy and lead to defective products.
3. Achieving consistent thickness control across production processes to ensure reliability and performance in applications like semiconductor chips and precision optical components.
SinceVision Solutions: SR8020 3D Laser Profiler
01High-Precision Through-Beam Measurement: With an X-axis width (reference distance) of 14.5mm, Z-axis linearity of ±0.02% F.S., and scanning speeds from 3,200 to 67,000 Hz, the SR8020 ensures thickness variation is maintained within 0.5μm/°C, delivering unmatched accuracy for standard block measurements.
02Real-Time Thermal Drift Compensation: The system minimizes environmental impacts like temperature fluctuations, ensuring consistent, reliable thickness measurements even in challenging conditions, enhancing process stability.
03Non-Contact, High-Speed Performance: Its advanced 3D profiling technology provides real-time monitoring and precision, meeting the demands of semiconductor, optics, and precision machining industries for quality and efficiency.
Camera Selection
| Model number | SR8020 | |||
| Reference distance (CD) | 23mm | |||
| Measuring range | Z-axis height (FS) | 5.2mm | ||
| X-axis width | Near side | 13mm | ||
| Reference distance | 14.5mm | |||
| Remote side | 16mm | |||
| Light source | Light source wavelength | 405nm blue light | ||
| Laser class | 2M | |||
| Laser output power | 10mW | |||
| Repetition accuracy | Z-axis (height) | 0.15μm | ||
| X-axis (width) | 1.5μm | |||
| linearity | Z-axis (height) | ±0.02% of F.S. | ||
| Contour data interval | X-axis (width) | 5μm | ||
| X-axis contour points | 3200 | |||
| Reflection Angle (°) | 41.5 | |||
| Scanning speed (Hz) | 3200 ~ 67000 | |||
| Dimension (mm) | 125.5×82×55 | |||
| Weight (g) | 650 | |||
| Temperature characteristic | 0.02% F.S./℃ | |||
| Encoder input | Single-ended, differential encoder is supported | |||
| Input/output | One 100Base-TX/1000Base-T Ethernet interface | |||
| Operation Temperature | 0～50℃ | |||
| Storage Temperature | -20～70℃ | |||
| Working Humidity | 35% to 85% without condensation | |||
| ESD Protection | Contact discharge 4kV, air discharge 8kV, in accordance with IEC 61000-4-2 standards | |||
| EFT protection | Power port 2kV/5 or 100kHz, signal port 1kV/5 or 100kHz, in accordance with IEC 61000-4-4 standards | |||
| Impact | 50Gs/3ms per axis, in accordance with IEC 68-2-27 Ea standard | |||
| Vibration | 10Gs (10-500Hz), compliant with IEC 68-2-6 Fc standard | |||
| degrees of protection provided by enclosure | IP67, in accordance with IEC 60529 standard | |||