Chip Appearance Defect Detection with SinceVision 3D Laser Profiler

Chip Appearance Defect Detection with SinceVision 3D Laser Profiler
Chip Appearance Defect Detection with SinceVision 3D Laser Profiler
Chip Appearance Defect Detection with SinceVision 3D Laser Profiler
Chip Appearance Defect Detection with SinceVision 3D Laser Profiler
Chip Appearance Defect Detection with SinceVision 3D Laser Profiler
Chip Appearance Defect Detection with SinceVision 3D Laser Profiler

Chip Appearance Defect Detection with SinceVision 3D Laser Profiler

Industry pain points and demands

     As chip sizes continue to shrink, achieving precision in chip quality is vital for maximizing product yield and performance. SinceVision's 3D Laser Profiler offers unparalleled accuracy for detecting minute defects, addressing the challenges posed by traditional manual inspection methods, which often suffer from slow detection speeds and low accuracy. By enhancing visual detection of chip appearance defects, manufacturers in the semiconductor sectors can significantly boost production efficiency, improve product quality, and cut down on labor costs.


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SinceVision Solution: SR7050 3D Laser Profiler

01With SinceVision's SR7050 3D Laser Profiler, achieve an X-axis resolution of 3200 points and a Z-axis repetition accuracy of 0.2μm for unparalleled precision in defect detection within semiconductor applications.
02Detect appearance defect sag depths greater than 0.2mm, enabling manufacturers to maintain stringent quality standards for chip production and improve overall product performance.
03Combining high stability with advanced 2D gray image calculations, the SR7050 3D Laser Profiler offers a comprehensive and reliable solution for detecting minute appearance defects.

Effect display

Camera Selection

Model number
SR7050
Reference distance (CD)50mm
Measuring rangeZ-axis height (FS)5 mm
X-axis widthProximal end30mm
Reference distanceThe 30.5 mm
Distal endThe 31.5 mm
Light sourceLight source wavelength405nm blue light
Laser class2M
Laser output power10mW
Repetition accuracyZ-axis (height)0.2 mu m
X-axis (width)2.5 mu m
linearityZ-axis (height)±0.05% F.S.
Contour data intervalX-axis (width)10 microns
X-axis contour points3200
Reflection Angle (°)45
Scanning speed (Hz)2500 ~ 8000
Foot inch (mm)160x98x48
Weight (g)750
Temperature characteristic0.02% F.S./℃
Encoder inputSingle-ended, differential coders are supported
Input/output1 100Base-TX/1000Base-T Ethernet interface
Operating temperature0~50℃
Storage temperature

'-20~70℃

Working humidity35% to 85% without condensation
ESD protectionContact discharge 4kV, air discharge 8kV, in accordance with IEC 61000-4-2 standards
EFT protectionPower port 2kV/5 or 100kHz, signal port 1kV/5 or 100kHz, in accordance with IEC 61000-4-4 standards
Impact50Gs/3ms per axis, in accordance with IEC 68-2-27 Ea standard
Vibration10Gs (10-500Hz), compliant with IEC 68-2-6 Fc standard
degrees of protection provided by enclosureIP67, in accordance with IEC 60529 standard